CID 69891

775-56-4

Structural Information

Molecular Formula
C11H18O2Si
SMILES
CCO[Si](C)(C1=CC=CC=C1)OCC
InChI
InChI=1S/C11H18O2Si/c1-4-12-14(3,13-5-2)11-9-7-6-8-10-11/h6-10H,4-5H2,1-3H3
InChIKey
MNFGEHQPOWJJBH-UHFFFAOYSA-N
Compound name
diethoxy-methyl-phenylsilane
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

0
References

8690
Patents

210.1076 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 211.11488 145.9
[M+Na]+ 233.09682 158.1
[M+NH4]+ 228.14142 154.3
[M+K]+ 249.07076 151.4
[M-H]- 209.10032 147.6
[M+Na-2H]- 231.08227 152.9
[M]+ 210.10705 148.2
[M]- 210.10815 148.2
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe