CID 121237783

1660153-91-2

Structural Information

Molecular Formula
C26H33N2P
SMILES
CC(C)(C)P(C1=CC=CC=C1)C2=CC=CC=C2C3=C(C=CC=C3N(C)C)N(C)C
InChI
InChI=1S/C26H33N2P/c1-26(2,3)29(20-14-9-8-10-15-20)24-19-12-11-16-21(24)25-22(27(4)5)17-13-18-23(25)28(6)7/h8-19H,1-7H3
InChIKey
HTHOMNNVAUPLKK-UHFFFAOYSA-N
Compound name
2-[2-[tert-butyl(phenyl)phosphanyl]phenyl]-1-N,1-N,3-N,3-N-tetramethylbenzene-1,3-diamine
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

81
Patents

404.23813 Da
Monoisotopic Mass

5.9
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 405.24541 205.8
[M+Na]+ 427.22735 208.9
[M-H]- 403.23085 216.1
[M+NH4]+ 422.27195 217.4
[M+K]+ 443.20129 205.7
[M+H-H2O]+ 387.23539 192.8
[M+HCOO]- 449.23633 232.4
[M+CH3COO]- 463.25198 241.0
[M+Na-2H]- 425.21280 202.2
[M]+ 404.23758 208.1
[M]- 404.23868 208.1
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe