CID 87427

18043-74-8

Structural Information

Molecular Formula
C12H30O4Si2
SMILES
CCO[Si](C)(CC[Si](C)(OCC)OCC)OCC
InChI
InChI=1S/C12H30O4Si2/c1-7-13-17(5,14-8-2)11-12-18(6,15-9-3)16-10-4/h7-12H2,1-6H3
InChIKey
HITBDIPWYKTHIH-UHFFFAOYSA-N
Compound name
2-[diethoxy(methyl)silyl]ethyl-diethoxy-methylsilane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

858
Patents

294.16827 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 295.17555 167.8
[M+Na]+ 317.15749 175.2
[M+NH4]+ 312.20209 173.1
[M+K]+ 333.13143 170.9
[M-H]- 293.16099 164.7
[M+Na-2H]- 315.14294 168.7
[M]+ 294.16772 167.8
[M]- 294.16882 167.8
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe