CID 87398

18001-60-0

Structural Information

Molecular Formula
C10H26O5Si2
SMILES
CCO[Si](C)(OCC)O[Si](C)(OCC)OCC
InChI
InChI=1S/C10H26O5Si2/c1-7-11-16(5,12-8-2)15-17(6,13-9-3)14-10-4/h7-10H2,1-6H3
InChIKey
OPHLEQJKSDAYRR-UHFFFAOYSA-N
Compound name
[diethoxy(methyl)silyl]oxy-diethoxy-methylsilane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

474
Patents

282.13187 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 283.13915 161.7
[M+Na]+ 305.12109 168.9
[M+NH4]+ 300.16569 166.6
[M+K]+ 321.09503 165.7
[M-H]- 281.12459 158.1
[M+Na-2H]- 303.10654 162.6
[M]+ 282.13132 161.5
[M]- 282.13242 161.5
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe