CID 87366

17933-85-6

Structural Information

Molecular Formula
C16H18OSi
SMILES
CCO[Si](C=C)(C1=CC=CC=C1)C2=CC=CC=C2
InChI
InChI=1S/C16H18OSi/c1-3-17-18(4-2,15-11-7-5-8-12-15)16-13-9-6-10-14-16/h4-14H,2-3H2,1H3
InChIKey
GGJQEMXRDJPGAH-UHFFFAOYSA-N
Compound name
ethenyl-ethoxy-diphenylsilane
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

0
References

713
Patents

254.11269 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 255.11997 159.0
[M+Na]+ 277.10191 173.6
[M+NH4]+ 272.14651 168.1
[M+K]+ 293.07585 164.7
[M-H]- 253.10541 163.7
[M+Na-2H]- 275.08736 169.2
[M]+ 254.11214 162.6
[M]- 254.11324 162.6
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe