CID 74576

Ethoxymethyldiphenylsilane

Structural Information

Molecular Formula
C15H18OSi
SMILES
CCO[Si](C)(C1=CC=CC=C1)C2=CC=CC=C2
InChI
InChI=1S/C15H18OSi/c1-3-16-17(2,14-10-6-4-7-11-14)15-12-8-5-9-13-15/h4-13H,3H2,1-2H3
InChIKey
ADLWTVQIBZEAGJ-UHFFFAOYSA-N
Compound name
ethoxy-methyl-diphenylsilane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

1136
Patents

242.11269 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 243.11997 154.4
[M+Na]+ 265.10191 160.6
[M-H]- 241.10541 160.6
[M+NH4]+ 260.14651 172.2
[M+K]+ 281.07585 157.2
[M+H-H2O]+ 225.10995 147.1
[M+HCOO]- 287.11089 176.7
[M+CH3COO]- 301.12654 190.7
[M+Na-2H]- 263.08736 161.9
[M]+ 242.11214 155.1
[M]- 242.11324 155.1
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe