CID 70896

Tetraphenoxysilane

Structural Information

Molecular Formula
C24H20O4Si
SMILES
C1=CC=C(C=C1)O[Si](OC2=CC=CC=C2)(OC3=CC=CC=C3)OC4=CC=CC=C4
InChI
InChI=1S/C24H20O4Si/c1-5-13-21(14-6-1)25-29(26-22-15-7-2-8-16-22,27-23-17-9-3-10-18-23)28-24-19-11-4-12-20-24/h1-20H
InChIKey
ADLSSRLDGACTEX-UHFFFAOYSA-N
Compound name
tetraphenyl silicate
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

0
References

5559
Patents

400.1131 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 401.12038 196.3
[M+Na]+ 423.10232 213.5
[M+NH4]+ 418.14692 204.8
[M+K]+ 439.07626 203.3
[M-H]- 399.10582 205.1
[M+Na-2H]- 421.08777 211.0
[M]+ 400.11255 201.7
[M]- 400.11365 201.7
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe