CID 66104

Tetraphenylsilane

Structural Information

Molecular Formula
C24H20Si
SMILES
C1=CC=C(C=C1)[Si](C2=CC=CC=C2)(C3=CC=CC=C3)C4=CC=CC=C4
InChI
InChI=1S/C24H20Si/c1-5-13-21(14-6-1)25(22-15-7-2-8-16-22,23-17-9-3-10-18-23)24-19-11-4-12-20-24/h1-20H
InChIKey
JLAVCPKULITDHO-UHFFFAOYSA-N
Compound name
tetraphenylsilane
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

9
References

2058
Patents

336.13342 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 337.14070 183.8
[M+Na]+ 359.12264 202.9
[M+NH4]+ 354.16724 194.6
[M+K]+ 375.09658 190.6
[M-H]- 335.12614 194.5
[M+Na-2H]- 357.10809 200.3
[M]+ 336.13287 190.2
[M]- 336.13397 190.2
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe