CID 66104

Tetraphenylsilane

Structural Information

Molecular Formula
C24H20Si
SMILES
C1=CC=C(C=C1)[Si](C2=CC=CC=C2)(C3=CC=CC=C3)C4=CC=CC=C4
InChI
InChI=1S/C24H20Si/c1-5-13-21(14-6-1)25(22-15-7-2-8-16-22,23-17-9-3-10-18-23)24-19-11-4-12-20-24/h1-20H
InChIKey
JLAVCPKULITDHO-UHFFFAOYSA-N
Compound name
tetraphenylsilane
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

9
References

3604
Patents

336.13342 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 337.14070 180.4
[M+Na]+ 359.12264 185.1
[M-H]- 335.12614 191.5
[M+NH4]+ 354.16724 192.7
[M+K]+ 375.09658 177.7
[M+H-H2O]+ 319.13068 169.7
[M+HCOO]- 381.13162 201.4
[M+CH3COO]- 395.14727 190.3
[M+Na-2H]- 357.10809 187.4
[M]+ 336.13287 176.8
[M]- 336.13397 176.8
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe