CID 6327777

Hexaphenyldilead

Structural Information

Molecular Formula
C18H15Pb
SMILES
C1=CC=C(C=C1)[Pb](C2=CC=CC=C2)C3=CC=CC=C3
InChI
InChI=1S/3C6H5.Pb/c3*1-2-4-6-5-3-1;/h3*1-5H;
InChIKey
SBXVIQINPJYMHB-UHFFFAOYSA-N
Compound name
None
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

0
References

147
Patents

439.09402 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 440.10130 189.4
[M+Na]+ 462.08324 206.1
[M+NH4]+ 457.12784 199.5
[M+K]+ 478.05718 193.7
[M-H]- 438.08674 197.6
[M+Na-2H]- 460.06869 201.3
[M]+ 439.09347 194.5
[M]- 439.09457 194.5
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe