CID 54207826

102089-33-8

Structural Information

Molecular Formula
C17H37NO3Si
SMILES
CCO[Si](C)(CCCOC1CC(NC(C1)(C)C)(C)C)OCC
InChI
InChI=1S/C17H37NO3Si/c1-8-20-22(7,21-9-2)12-10-11-19-15-13-16(3,4)18-17(5,6)14-15/h15,18H,8-14H2,1-7H3
InChIKey
PTUAFEVULPLJPF-UHFFFAOYSA-N
Compound name
diethoxy-methyl-[3-(2,2,6,6-tetramethylpiperidin-4-yl)oxypropyl]silane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

18
Patents

331.25427 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 332.26155 180.6
[M+Na]+ 354.24349 188.3
[M+NH4]+ 349.28809 188.8
[M+K]+ 370.21743 179.4
[M-H]- 330.24699 179.6
[M+Na-2H]- 352.22894 184.8
[M]+ 331.25372 181.6
[M]- 331.25482 181.6
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe