CID 4670738

18412-57-2

Structural Information

Molecular Formula
C13H22O3Si
SMILES
CCO[Si](C1=CC=C(C=C1)C)(OCC)OCC
InChI
InChI=1S/C13H22O3Si/c1-5-14-17(15-6-2,16-7-3)13-10-8-12(4)9-11-13/h8-11H,5-7H2,1-4H3
InChIKey
PADYPAQRESYCQZ-UHFFFAOYSA-N
Compound name
triethoxy-(4-methylphenyl)silane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

1194
Patents

254.13382 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 255.14110 157.4
[M+Na]+ 277.12304 169.0
[M+NH4]+ 272.16764 164.9
[M+K]+ 293.09698 162.7
[M-H]- 253.12654 158.5
[M+Na-2H]- 275.10849 163.2
[M]+ 254.13327 159.4
[M]- 254.13437 159.4
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe