CID 44146926

Dibutoxyethoxymethylsilane

Structural Information

Molecular Formula

C₁₁H₂₆O₃Si

SMILES

CCCCO[Si](C)(OCC)OCCCC

InChI

InChI=1S/C11H26O3Si/c1-5-8-10-13-15(4,12-7-3)14-11-9-6-2/h5-11H2,1-4H3

InChIKey

LPRCYVDNJBDBQF-UHFFFAOYSA-N

Compound name

dibutoxy-ethoxy-methylsilane

Related CIDs

2D Structure

compound 2d structure

1
Annotation Hits: 0
References: 7
Patents: 234.16512 Da
Monoisotopic Mass: None
XlogP (predicted)

Profile

Predicted Collision Cross Section

m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Å²) per adduct calculated using CCSbase.
Adduct	m/z	Predicted CCS (Å²)
[M+H]+	235.17240	155.1
[M+Na]+	257.15434	163.7
[M+NH4]+	252.19894	161.5
[M+K]+	273.12828	158.1
[M-H]-	233.15784	153.3
[M+Na-2H]-	255.13979	157.1
[M]+	234.16457	155.6
[M]-	234.16567	155.6

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe