CID 44146926

Dibutoxyethoxymethylsilane

Structural Information

Molecular Formula
C11H26O3Si
SMILES
CCCCO[Si](C)(OCC)OCCCC
InChI
InChI=1S/C11H26O3Si/c1-5-8-10-13-15(4,12-7-3)14-11-9-6-2/h5-11H2,1-4H3
InChIKey
LPRCYVDNJBDBQF-UHFFFAOYSA-N
Compound name
dibutoxy-ethoxy-methylsilane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

15
Patents

234.16512 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 235.172396 157.6
[M+Na]+ 257.154338 162.7
[M-H]- 233.157844 157.0
[M+NH4]+ 252.198943 176.4
[M+K]+ 273.128278 162.8
[M+H-H2O]+ 217.162380 152.2
[M+HCOO]- 279.163321 178.5
[M+CH3COO]- 293.178971 191.8
[M+Na-2H]- 255.139786 162.1
[M]+ 234.16457142 165.2
[M]- 234.16566858 165.2
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe