CID 44146926

Dibutoxyethoxymethylsilane

Structural Information

Molecular Formula
C11H26O3Si
SMILES
CCCCO[Si](C)(OCC)OCCCC
InChI
InChI=1S/C11H26O3Si/c1-5-8-10-13-15(4,12-7-3)14-11-9-6-2/h5-11H2,1-4H3
InChIKey
LPRCYVDNJBDBQF-UHFFFAOYSA-N
Compound name
dibutoxy-ethoxy-methylsilane
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

16
Patents

234.16512 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 235.17240 157.6
[M+Na]+ 257.15434 162.7
[M-H]- 233.15784 157.0
[M+NH4]+ 252.19894 176.4
[M+K]+ 273.12828 162.8
[M+H-H2O]+ 217.16238 152.2
[M+HCOO]- 279.16332 178.5
[M+CH3COO]- 293.17897 191.8
[M+Na-2H]- 255.13979 162.1
[M]+ 234.16457 165.2
[M]- 234.16567 165.2
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe