CID 396170

Nsc701718

Structural Information

Molecular Formula
C24H38N2O4Si
SMILES
CCC1=C(N(C(=O)NC1=O)COCCO[Si](C)(C)C(C)(C)C)CC2=CC(=CC(=C2)C)C
InChI
InChI=1S/C24H38N2O4Si/c1-9-20-21(15-19-13-17(2)12-18(3)14-19)26(23(28)25-22(20)27)16-29-10-11-30-31(7,8)24(4,5)6/h12-14H,9-11,15-16H2,1-8H3,(H,25,27,28)
InChIKey
XLTFTPOBJVLWPC-UHFFFAOYSA-N
Compound name
1-[2-[tert-butyl(dimethyl)silyl]oxyethoxymethyl]-6-[(3,5-dimethylphenyl)methyl]-5-ethylpyrimidine-2,4-dione
Related CIDs

2D Structure

compound 2d structure
1
Annotation Hits

0
References

0
Patents

446.26007 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 447.26735 211.7
[M+Na]+ 469.24929 219.1
[M-H]- 445.25279 214.5
[M+NH4]+ 464.29389 219.1
[M+K]+ 485.22323 214.3
[M+H-H2O]+ 429.25733 202.4
[M+HCOO]- 491.25827 225.6
[M+CH3COO]- 505.27392 232.1
[M+Na-2H]- 467.23474 211.3
[M]+ 446.25952 219.2
[M]- 446.26062 219.2
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

No patent data available for this compound.