CID 27099

Cupric ion

Structural Information

Molecular Formula
Cu
SMILES
[Cu+2]
InChI
InChI=1S/Cu/q+2
InChIKey
JPVYNHNXODAKFH-UHFFFAOYSA-N
Compound name
copper(2+)
Related CIDs

2D Structure

compound 2d structure
7
Annotation Hits

10
References

40084
Patents

62.929596 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 63.936872 105.4
[M+Na]+ 85.918814 113.7
[M-H]- 61.922320 106.2
[M+NH4]+ 80.963419 131.4
[M+K]+ 101.89275 109.7
[M+H-H2O]+ 45.926856 104.1
[M+HCOO]- 107.92780 130.6
[M+CH3COO]- 121.94345 146.7
[M+Na-2H]- 83.904262 117.3
[M]+ 62.929047 103.9
[M]- 62.930145 103.9
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe