CID 23978

Copper

Structural Information

Molecular Formula
Cu
SMILES
[Cu]
InChI
InChI=1S/Cu
InChIKey
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Compound name
copper
Related CIDs

2D Structure

compound 2d structure
11
Annotation Hits

84043
References

2091645
Patents

62.929596 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 63.936872 105.6
[M+Na]+ 85.918814 113.8
[M-H]- 61.922320 106.0
[M+NH4]+ 80.963419 131.8
[M+K]+ 101.89275 114.9
[M+H-H2O]+ 45.926856 101.4
[M+HCOO]- 107.92780 131.0
[M+CH3COO]- 121.94345 153.0
[M+Na-2H]- 83.904262 115.5
[M]+ 62.929047 105.3
[M]- 62.930145 105.3
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

literature stripe

Patent stripe

patents stripe