CID 23978

Copper

Structural Information

Molecular Formula
Cu
SMILES
[Cu]
InChI
InChI=1S/Cu
InChIKey
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Compound name
copper
Related CIDs

2D Structure

compound 2d structure
11
Annotation Hits

84429
References

2197025
Patents

62.929596 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 63.936872 105.6
[M+Na]+ 85.918814 113.8
[M-H]- 61.922320 106.0
[M+NH4]+ 80.963419 131.8
[M+K]+ 101.89275 114.9
[M+H-H2O]+ 45.926856 101.4
[M+HCOO]- 107.92780 131.0
[M+CH3COO]- 121.94345 153.0
[M+Na-2H]- 83.904262 115.5
[M]+ 62.929047 105.3
[M]- 62.930145 105.3
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

No patent data available for this compound.