CID 23978

Copper

Structural Information

Molecular Formula

SMILES

[Cu]

InChI

InChI=1S/Cu

InChIKey

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Compound name

copper

Related CIDs

2D Structure

compound 2d structure

10
Annotation Hits: 83453
References: 1297807
Patents: 62.929596 Da
Monoisotopic Mass: None
XlogP (predicted)

Profile

Predicted Collision Cross Section

m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Å²) per adduct calculated using CCSbase.
Adduct	m/z	Predicted CCS (Å²)
[M+H]+	63.936872	105.1
[M+Na]+	85.918814	117.3
[M+NH4]+	80.963419	115.2
[M+K]+	101.89275	110.6
[M-H]-	61.922320	105.9
[M+Na-2H]-	83.904262	111.1
[M]+	62.929047	107.0
[M]-	62.930145	107.0

Literature stripe

literature stripe

Patent stripe

patents stripe