CID 21852555

Dtxsid10100969

Structural Information

Molecular Formula
C23H30O5Si3
SMILES
CO[Si](C)(C1=CC=CC=C1)O[Si](C2=CC=CC=C2)(OC)O[Si](C)(C3=CC=CC=C3)OC
InChI
InChI=1S/C23H30O5Si3/c1-24-29(4,21-15-9-6-10-16-21)27-31(26-3,23-19-13-8-14-20-23)28-30(5,25-2)22-17-11-7-12-18-22/h6-20H,1-5H3
InChIKey
WYKMLDDHZCKJRO-UHFFFAOYSA-N
Compound name
methoxy-bis[(methoxy-methyl-phenylsilyl)oxy]-phenylsilane
Related CIDs

2D Structure

compound 2d structure
2
Annotation Hits

0
References

11
Patents

470.1401 Da
Monoisotopic Mass

None
XlogP (predicted)

Profile

Predicted Collision Cross Section

Adduct m/z Predicted CCS (Ų)
[M+H]+ 471.14738 209.4
[M+Na]+ 493.12932 212.1
[M-H]- 469.13282 217.4
[M+NH4]+ 488.17392 217.7
[M+K]+ 509.10326 210.0
[M+H-H2O]+ 453.13736 198.7
[M+HCOO]- 515.13830 226.4
[M+CH3COO]- 529.15395 225.6
[M+Na-2H]- 491.11477 216.1
[M]+ 470.13955 214.9
[M]- 470.14065 214.9
m/z: mass to charge ratio of the adduct.
Predicted Collision Cross Section (CCS) values (Ų) per adduct calculated using CCSbase.

Literature stripe

No literature data available for this compound.

Patent stripe

patents stripe